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New type of bonding chip -- single-sided with dual electrodes NTC chip
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New type of bonding chip -- single-sided with dual electrodes NTC chip


As a thermal component, NTC chip shall shorten its response / reaction time by tightly closing to the heat generating source, for example, if the NTC chip is applied in circuit for IC overheat protecting, the chip must be tightly closed to the IC surface. The regular and traditional NTC chip is with two electrodes on top and bottom sides. The bottom side is usually sticked with soldering paste and make the chip bottom sticked with heat generating source by wave or reflow soldering. The top side is for bonding wiring. The advantages are: the NTC chip shall be touched the heat generating source so temperature measuring is fast and reaction time is short, and the accuracy is high without any effect from outside. The disadvantage are: it’s no easy to bond at the bottom side. As different components are with different operating temperature, the method applying paste soldering and wave or reflow soldering is not suitable for all chips.

Be aimed at above-mentioned condition, Exsense pushes out a new type of NTC chip, that is, single-sided with dual-electrode NTC chip.


The advantages are:

1. two electrodes are one same side which is more suitable for bonding wiring. No limitation of installing position so that it’s flexible enough. The bottom side of the chip can be sticked by red glue or other adhesive to any position needs to be measured temperature. The surface electrodes can be connected by bonding wiring.


2. Miniature dimension, short response time of temperature sensing and high accuracy of temperature measuring. As the NTC chip contacts heat generating source directly, and is protected tightly by black resin, so there’s very small, even no effect from outside, and so the chip can measure and reflect the real or almost real temperature the heating sourse.